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Systems for the assembly and soldering of Through Hole components and SMD

Dispensing needles and microvalves

DL Technologies – USA

Real time thermal profiling and process monitoring systems for Convection reflow ovens and wave solder machines

KIC Thermal Profiling – USA

Automatic SMD pick & place machines.

Mycronic AB, Sweden

Screen printing machines for solder pastes and epoxies

Speedline Technologies, MPM – USA

Liquid dispensing systems for SMD epoxies, solder pastes, gasketing materials etc.

Speedline Technologies, Camalot – USA

Reflow ovens, wave soldering and selective soldering machines

Vitronics- Soltec – USA and Holland

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Large capacity automatic storage systems for SMD components

Large capacity automatic storage systems for SMD components

Essegi System - Storage Solutions - Italy

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Automatic Optical Inspection, Solder Paste Inspection, metrology systems, X-ray inspection systems

Automatic Optical Inspection of components and solder joints on assembled PCBs
Automatic Solder Paste Inspection systems

CyberOptics – USA

Automatic X-Ray inspection systems of solder joints and components.

GE Sensing & Inspection Technologies
Phoenix x-ray – Germany

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Assembly and test systems for the microelectronics, solar and semiconductor industries

Automatic die bonders and die sorting systems.

Besi Austria GmbH (former Datacon Technology GmbH).

High speed Die bonders and flip chip bonders

Besi Switzerland AG (former ESEC Ltd.)

Molding and sawing systems.

Besi Netherlands B.V. (former Fico B.V.)

Fibers alignment systems.
Micro-optics automatic assembly systems with passive and active alignment.
Automatic dies and odd-form components assembly and testing.
Optical packages sealing systems by laser welding.

ficonTEC Service GmbH – Germany

Automatic wire bonding systems

Kulicke & Soffa Inc - USA

Seam Sealing systems

Miyachi Unitek – USA

Wafer level and dies bumping, packaging equipment and services

PAC TECH Packaging Technologies GmbH - Germany

Plasma cleaning, etching, activation and Nanocoating systems

Europlasma NV - Belgium

Conductive, heat conductive, SMT and UV curable adhesives. Underfill, Dam & Fill materials . Glass paste & glass frits

NAMICS Corporation - Japan

Semiautomatic die bonders and die sorters. Manual die ejectors

SEC-Semiconductor Equipment Corporation - USA

Fluxless/void free vacuum/pressure soldering ovens
High vacuum ovens with Geter activation function

SST International – USA

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Optronic products assembly and test systems

Micro-optics automatic assembly systems with passive and active alignment
Laser bars/dies stacking/unstacking systems with automatic optical inspection.
Laser welding systems of optical packages.

ficonTEC Service GmbH – Germany

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Customized machines for specific assembly, welding and test applications

Assembly and test machines manufactured to customer requirements

ficonTEC Service GmbH – Germany

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Hyperspectral imaging systems and IR cameras

Hyperspectral imaging systems with FT-IR technology for remote sensing

Fast IR cameras. 1000fps

High resolution IR cameras 1280X1024 pixels

Telops Inc. – Canada and USA

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