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Product Category: Assembly and test systems for the microelectronics, opto-electronics and photonics industries. Optical fiber communication components, LIDAR systems and cameras production

Microelectronics automatic assembly and test systems

Machines for Sintering bonding and Scanning Acoustic Microscopy systems

By ortekAdmin Posted on April 18, 2022 Posted in
Machines for Sintering bonding and Scanning Acoustic Microscopy systems

Automatic die bonders and die sorting systems.

By ortekAdmin Posted on June 17, 2021 Posted in
Automatic die bonders and die sorting systems.

High speed Die bonders and flip chip bonders

By ortekAdmin Posted on June 17, 2021 Posted in
High speed Die bonders and flip chip bonders

Molding and sawing systems.

By ortekAdmin Posted on June 17, 2021 Posted in
Molding and sawing systems.

Adhesives and materials for adhesion applications for hardening in UV and heat

By ortekAdmin Posted on October 5, 2021 Posted in
Adhesives and materials for adhesion applications for hardening in UV and heat

Fibers alignment systems. Micro-optics automatic assembly systems with passive and active alignment. Automatic dies and odd-form components assembly and testing. Optical packages sealing systems by laser welding.

By ortekAdmin Posted on June 17, 2021 Posted in
Fibers alignment systems. Micro-optics automatic assembly systems with passive and active alignment. Automatic dies and odd-form components assembly and testing. Optical packages sealing systems by laser welding.

Plasma cleaning, etching, activation and Nanocoating systems

By ortekAdmin Posted on June 17, 2021 Posted in
Plasma cleaning, etching, activation and Nanocoating systems

Automatic wire bonding systems

By ortekAdmin Posted on June 17, 2021 Posted in
Automatic wire bonding systems

Seam Sealing systems

By ortekAdmin Posted on June 17, 2021 Posted in
Seam Sealing systems

Bond testing and micro materials testing systems

By ortekAdmin Posted on June 17, 2021 Posted in
Bond testing and micro materials testing systems

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